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The current imx8mp-dhcom-som.dtsi describes prototype rev.100 SoM, update the DT to describe production rev.200 SoM which brings the following changes: - Fast SoC GPIOs exposed on the SoM edge connector - Slow GPIOs like component resets moved to I2C GPIO expander - ADC upgraded from TLA2024 to ADS1015 with conversion interrupt - EEPROM size increased from 256 B to 4 kiB Signed-off-by: Marek Vasut <marex@denx.de>