rv1106: rv1106_hpmcu_wrap: update version to v1.70

build from rockit-ko commit in master branch:
    db3c2c7 mcu_bin: support multiple pipe wrap version v1.7.0rc11

build from hal commit in master branch:
    https://10.10.10.29/c/rk/mcu/hal/+/170393
    a76806e7 project: common: riscv: change riscv toolchain to xpack

Signed-off-by: aaron.sun <aaron.sun@rock-chips.com>
Change-Id: Ie7a65d2b3d46eeea415beba8ea8bc5c97ea6d1be
This commit is contained in:
aaron.sun
2024-04-03 14:51:47 +08:00
parent 572091385b
commit 670d3cd824
6 changed files with 26 additions and 2 deletions

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@@ -4,4 +4,4 @@ COMPRESSION=lzma
TOSTA=bin/rv11/rv1106_tee_ta_v1.10.bin
ADDR=0x03000000
[MCU]
MCU1=bin/rv11/rv1106_hpmcu_wrap_v1.60.bin,0xff6ff000,disabled
MCU1=bin/rv11/rv1106_hpmcu_wrap_v1.70.bin,0xff6fe000,disabled

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@@ -1,4 +1,4 @@
[COMPRESSION]
COMPRESSION=gzip
[MCU]
MCU1=bin/rv11/rv1106_hpmcu_wrap_v1.60.bin,0xff6ff000,okay
MCU1=bin/rv11/rv1106_hpmcu_wrap_v1.70.bin,0xff6fe000,okay

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@@ -1,5 +1,17 @@
# RV1106 Release Note
## rv1106_hpmcu_wrap_v1.70.bin
| 时间 | 文件 | 编译 commit | 重要程度 |
| --------- | :-------------------------- | ------------------------------- | -------- |
| 2024-04-03 | rv1106_hpmcu_wrap_v1.70.bin | rockit_ko:db3c2c7#hal:a76806e7 | 重要 |
### New
1. 支持双摄卷绕。
------
## rv1106_usbplug_v1.09.bin
| 时间 | 文件 | 编译 commit | 重要程度 |

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@@ -1,5 +1,17 @@
# RV1106 Release Note
## rv1106_hpmcu_wrap_v1.70.bin
| Date | File | Build commit | Severity |
| --------- | :-------------------------- | ------------------------------- | -------- |
| 2024-04-03 | rv1106_hpmcu_wrap_v1.70.bin | rockit_ko:db3c2c7#hal:a76806e7 | important |
### New
1. Support double channel wrap.
------
## rv1106_usbplug_v1.09.bin
| Date | File | Build commit | Severity |