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rv1106: rv1106_hpmcu_wrap: update version to v1.56

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build from rockit-ko commit in master branch:
    d1a2dabb mcu bin: update version to v1.56

build from hal commit in master branch:
    a76806e7 project: common: riscv: change riscv toolchain to xpack

Signed-off-by: Chuanhu Sun <aaron.sun@rock-chips.com>
Change-Id: I6b68da9da9c604adc4a1e39d9b98e764d96ca3a2
This commit is contained in:
Chuanhu Sun
2023-03-22 14:46:59 +08:00
committed by Jianhong Chen
parent 78cbbc4f9c
commit ddca0f3a56
6 changed files with 26 additions and 2 deletions
Download Patch File Download Diff File Expand all files Collapse all files

2
RKTRUST/RV1106TOS.ini
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@@ -1,4 +1,4 @@
[COMPRESSION]
COMPRESSION=lzma
[MCU]
MCU0=bin/rv11/rv1106_hpmcu_wrap_v1.54.bin,0xff6ff000,disabled
MCU0=bin/rv11/rv1106_hpmcu_wrap_v1.56.bin,0xff6ff000,disabled

2
RKTRUST/RV1106TOS_TB.ini
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@@ -1,4 +1,4 @@
[COMPRESSION]
COMPRESSION=gzip
[LOAD]
LOAD0=bin/rv11/rv1106_hpmcu_wrap_v1.54.bin,0xff6ff000,okay
LOAD0=bin/rv11/rv1106_hpmcu_wrap_v1.56.bin,0xff6ff000,okay

BIN
bin/rv11/rv1106_hpmcu_wrap_v1.54.bin
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BIN
bin/rv11/rv1106_hpmcu_wrap_v1.56.bin Normal file
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12
doc/release/RV1106_CN.md
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@@ -1,5 +1,17 @@
# RV1106 Release Note
## rv1106_hpmcu_wrap_v1.56.bin
| 时间 | 文件 | 编译 commit | 重要程度 |
| --------- | :-------------------------- | ------------------------------- | -------- |
| 2023-05-11 | rv1106_hpmcu_wrap_v1.56.bin | rockit_ko:d1a2dabb#hal:a76806e7 | 重要 |
### New
1. 适配新的卷绕框架。
------
## rv1106_hpmcu_tb_{sc230ai,sc3338,sc4336,dual_sc3338}_v1.65.bin
| 时间 | 文件 | 编译 commit | 重要程度 |

12
doc/release/RV1106_EN.md
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@@ -1,5 +1,17 @@
# RV1106 Release Note
## rv1106_hpmcu_wrap_v1.56.bin
| Date | File | Build commit | Severity |
| ---------- | :-------------------------- | ------------------------------- | -------- |
| 2023-05-11 | rv1106_hpmcu_wrap_v1.56.bin | rockit_ko:d1a2dabb#hal:a76806e7 | important |
### New
1. Use new wrap struct.
------
## rv1106_hpmcu_tb_{sc230ai,sc3338,sc4336,dual_sc3338}_v1.65.bin
| Date | File | Build commit | Severity |